Method of producing an optoelectronic component having a sulfur-adhesion layer bonded to a dielectric layer
US-9219199-B2 · Dec 22, 2015 · US
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Höppel Lutz patents in 2015
Höppel Lutz was listed as an assignee on 6 patent publications in 2015.
| Metric | Value |
|---|---|
| Company | Höppel Lutz |
| Year | 2015 |
| Patents | 6 |
Patents
Representative publications for Höppel Lutz in 2015.
Lighting apparatus
US-9179507-B2 · Nov 3, 2015 · US
Radiation-emitting semiconductor chip
US-9054016-B2 · Jun 9, 2015 · US
Optoelectronic component
US-9000476-B2 · Apr 7, 2015 · US
Optoelectronic semiconductor chip
US-8994000-B2 · Mar 31, 2015 · US
Top CPC classifications
Most common classification codes for Höppel Lutz in 2015.
| CPC | Patents |
|---|---|
| H01L2924/00 | 3 |
| H01L2924/0002 | 3 |
| H10H20/857 | 3 |
| H01L25/167 | 2 |
| H01L33/22 | 2 |
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