Wafer-level flip chip device packages and related methods
US-9231178-B2 · Jan 5, 2016 · US
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Tischler Michael A patents
Tischler Michael A holds 2 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 2 |
| Recent patents | 0 |
| First publication | Feb 3, 2015 |
| Latest publication | Jan 5, 2016 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Wiring boards for array-based electronic devices
US-8947001-B2 · Feb 3, 2015 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Wafer-level flip chip device packages and related methods
US-9231178-B2 · Jan 5, 2016 · US
Wiring boards for array-based electronic devices
US-8947001-B2 · Feb 3, 2015 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10W74/15 | 2 |
| H10W74/00 | 1 |
| H10W72/944 | 1 |
| H10W72/953 | 1 |
| H10W72/952 | 1 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 2 |