Bonding device and method for producing plate-shaped bonded assembly
US-9789674-B2 · Oct 17, 2017 · US
This page is not indexed by search engines while we improve data quality.
Usui Hiroyuki patents
Usui Hiroyuki holds 3 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 3 |
| Recent patents | 0 |
| First publication | Feb 17, 2015 |
| Latest publication | Oct 17, 2017 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Bonding device and method for producing plate-shaped bonded assembly
US-9789674-B2 · Oct 17, 2017 · US
Multiprocessor with a plurality of debug modules and debug ring units connected to generate a ring
US-9063915-B2 · Jun 23, 2015 · US
Information processor and multi-core system
US-8959303-B2 · Feb 17, 2015 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| B29C66/73366 | 1 |
| G02F1/1341 | 1 |
| B29C66/81267 | 1 |
| B29C66/343 | 1 |
| B29C65/4845 | 1 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Physics | 3 |
| Operations & Transport | 1 |
| Electricity | 1 |