Package-on-package assembly with wire bond vias
US-9105483-B2 · Aug 11, 2015 · US
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Yang Se Young patents
Yang Se Young holds 2 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 2 |
| Recent patents | 0 |
| First publication | Mar 17, 2015 |
| Latest publication | Aug 11, 2015 |
Filing trend
Year-over-year patent counts for this assignee.
Not enough yearly data to assess filing trend yet.
| Year | Patents |
|---|---|
| 2015 | 2 |
| Year | Patents |
|---|---|
| 2015 | 2 |
Recent patents
Latest publications where this party is an assignee.
TSV fabrication using a removable handling structure
US-8978247-B2 · Mar 17, 2015 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Package-on-package assembly with wire bond vias
US-9105483-B2 · Aug 11, 2015 · US
TSV fabrication using a removable handling structure
US-8978247-B2 · Mar 17, 2015 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10W90/724 | 2 |
| H10W72/252 | 2 |
| H01L2224/131 | 2 |
| H01L2924/014 | 2 |
| H10P72/7424 | 1 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 2 |
| Cross-Sectional Technologies | 2 |