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Damberg Philip patents

Damberg Philip holds 4 patents in our database, with recent filings and technology areas summarized below.

Company patent statistics
Metric	Value
Total patents	4
Recent patents	0
First publication	Feb 17, 2015
Latest publication	Sep 15, 2015

Filing trend

Year-over-year patent counts for this assignee.

Not enough yearly data to assess filing trend yet.

Patents filed per year
Year	Patents
2015	4

Browse patents by year
Year	Patents
2015	4

Recent patents

Latest publications where this party is an assignee.

Impedence controlled packages with metal sheet or 2-layer RDL
US-9136197-B2 · Sep 15, 2015 · US
Semiconductor chip assembly and method for making same
US-9137903-B2 · Sep 15, 2015 · US
Package-on-package assembly with wire bond vias
US-9105483-B2 · Aug 11, 2015 · US
Microelectronic assembly comprising dielectric structures with different young modulus and having reduced mechanical stresses between the device terminals and external contacts
US-8957520-B2 · Feb 17, 2015 · US

Notable patents

Representative or frequently cited publications from precomputed assignee stats.

Impedence controlled packages with metal sheet or 2-layer RDL
US-9136197-B2 · Sep 15, 2015 · US
Semiconductor chip assembly and method for making same
US-9137903-B2 · Sep 15, 2015 · US
Package-on-package assembly with wire bond vias
US-9105483-B2 · Aug 11, 2015 · US
Microelectronic assembly comprising dielectric structures with different young modulus and having reduced mechanical stresses between the device terminals and external contacts
US-8957520-B2 · Feb 17, 2015 · US

Top CPC classifications

Most common classification codes in this portfolio.

Top CPC codes by patent count
CPC	Patents
H10W90/734	4
H10W90/701	4
H10W74/117	4
H01L2924/00	4
H01L23/3128	4

Technology areas

Mapped technology topics for this assignee.

Company technology slices
Technology	Patents
Electricity	4
Cross-Sectional Technologies	2
Operations & Transport	1