Reliable semiconductor packages
US-2021399035-A1 · Dec 23, 2021 · US
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Utac Headquarters Pte Ltd patents in 2021
Utac Headquarters Pte Ltd was listed as an assignee on 12 patent publications in 2021.
| Metric | Value |
|---|---|
| Company | Utac Headquarters Pte Ltd |
| Year | 2021 |
| Patents | 12 |
Patents
Representative publications for Utac Headquarters Pte Ltd in 2021.
Reliable semiconductor packages
US-2021391368-A1 · Dec 16, 2021 · US
Reliable semiconductor packages
US-2021366963-A1 · Nov 25, 2021 · US
Reliable semiconductor packages
US-11177301-B2 · Nov 16, 2021 · US
Conductive bonding layer with spacers between a package substrate and chip
US-11145575-B2 · Oct 12, 2021 · US
Top CPC classifications
Most common classification codes for Utac Headquarters Pte Ltd in 2021.
| CPC | Patents |
|---|---|
| H10W74/00 | 7 |
| H10F39/804 | 6 |
| H10W72/073 | 5 |
| H10W72/075 | 5 |
| H01L27/14618 | 4 |
Related pages
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