Capacitive sensing node integration to a surface of a mechanical part
US-9488460-B2 · Nov 8, 2016 · US
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Teng Ling Chih Daniel — Physics
Teng Ling Chih Daniel holds 1 patent in Physics, with representative filings summarized below.
| Metric | Value |
|---|---|
| Company | Teng Ling Chih Daniel |
| Technology | Physics |
| Patents in slice | 1 |
| Recent patents in slice | 0 |
| First year | 2016 |
| Last year | 2016 |
Representative patents
Notable publications linking Teng Ling Chih Daniel to Physics.
Capacitive sensing node integration to a surface of a mechanical part
US-9488460-B2 · Nov 8, 2016 · US
Capacitive sensing node integration to a surface of a mechanical part
US-9488460-B2 · Nov 8, 2016 · US
Capacitive sensing node integration to a surface of a mechanical part
US-9488460-B2 · Nov 8, 2016 · US
Capacitive sensing node integration to a surface of a mechanical part
US-9488460-B2 · Nov 8, 2016 · US
Recent filings
Latest patents from Teng Ling Chih Daniel in Physics.
Capacitive sensing node integration to a surface of a mechanical part
US-9488460-B2 · Nov 8, 2016 · US
Capacitive sensing node integration to a surface of a mechanical part
US-9488460-B2 · Nov 8, 2016 · US
Capacitive sensing node integration to a surface of a mechanical part
US-9488460-B2 · Nov 8, 2016 · US
Capacitive sensing node integration to a surface of a mechanical part
US-9488460-B2 · Nov 8, 2016 · US
Capacitive sensing node integration to a surface of a mechanical part
US-9488460-B2 · Nov 8, 2016 · US
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