Heat dissipation material and light emitting diode package including a junction part made of the heat dissipation material
US-9516739-B2 · Dec 6, 2016 · US
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Chu Kun Mo patents
Chu Kun Mo holds 3 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 3 |
| Recent patents | 0 |
| First publication | Apr 7, 2015 |
| Latest publication | Dec 6, 2016 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Heat dissipation material and light emitting diode package including a junction part made of the heat dissipation material
US-9516739-B2 · Dec 6, 2016 · US
Heating composite, and heating apparatus and fusing apparatus including the same
US-9348280-B2 · May 24, 2016 · US
Heat dissipation material and light emitting diode package including a junction part made of the heat dissipation material
US-9000473-B2 · Apr 7, 2015 · US
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Operations & Transport | 3 |
| Chemistry & Metallurgy | 3 |
| Electricity | 3 |
| Physics | 1 |
| Cross-Sectional Technologies | 1 |