Method of forming semiconductor structures with contact holes
US-9449822-B2 · Sep 20, 2016 · US
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Li Wai-Kin patents
Li Wai-Kin holds 5 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 5 |
| Recent patents | 0 |
| First publication | Jun 2, 2015 |
| Latest publication | Sep 20, 2016 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Method for fabricating a physical unclonable interconnect function array
US-9331012-B2 · May 3, 2016 · US
Near-infrared absorptive layer-forming composition and multilayer film
US-9069245-B2 · Jun 30, 2015 · US
Lateral-dimension-reducing metallic hard mask etch
US-9059250-B2 · Jun 16, 2015 · US
Method for monitoring focus on an integrated wafer
US-9046788-B2 · Jun 2, 2015 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Method of forming semiconductor structures with contact holes
US-9449822-B2 · Sep 20, 2016 · US
Method for fabricating a physical unclonable interconnect function array
US-9331012-B2 · May 3, 2016 · US
Near-infrared absorptive layer-forming composition and multilayer film
US-9069245-B2 · Jun 30, 2015 · US
Lateral-dimension-reducing metallic hard mask etch
US-9059250-B2 · Jun 16, 2015 · US
Method for monitoring focus on an integrated wafer
US-9046788-B2 · Jun 2, 2015 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10P76/4088 | 2 |
| H01L21/0338 | 2 |
| H10W20/089 | 2 |
| H10W20/43 | 2 |
| H10P76/4085 | 1 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 3 |
| Physics | 2 |
| Cross-Sectional Technologies | 1 |