3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach
US-9142510-B2 · Sep 22, 2015 · US
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Ma Hang-Shing patents in 2015
Ma Hang-Shing was listed as an assignee on 1 patent publication in 2015.
| Metric | Value |
|---|---|
| Company | Ma Hang-Shing |
| Year | 2015 |
| Patents | 1 |
Patents
Representative publications for Ma Hang-Shing in 2015.
Top CPC classifications
Most common classification codes for Ma Hang-Shing in 2015.
| CPC | Patents |
|---|---|
| H01L21/6835 | 1 |
| H01L21/76807 | 1 |
| H01L21/76898 | 1 |
| H01L2221/6835 | 1 |
| H01L2224/02372 | 1 |
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