3D interconnect structure comprising fine pitch single damascene backside metal redistribution lines combined with through-silicon vias
US-9449913-B2 · Sep 20, 2016 · US
This page is not indexed by search engines while we improve data quality.
Kothari Hiten patents
Kothari Hiten holds 2 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 2 |
| Recent patents | 0 |
| First publication | Sep 22, 2015 |
| Latest publication | Sep 20, 2016 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
3D interconnect structure comprising fine pitch single damascene backside metal redistribution lines combined with through-silicon vias
US-9449913-B2 · Sep 20, 2016 · US
3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach
US-9142510-B2 · Sep 22, 2015 · US
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 2 |