Metal core printed circuit board and electronic package structure
US-9386686-B2 · Jul 5, 2016 · US
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Huang Chi-Feng patents
Huang Chi-Feng holds 4 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 4 |
| Recent patents | 0 |
| First publication | May 5, 2015 |
| Latest publication | Jul 5, 2016 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
HVMOS reliability evaluation using bulk resistances as indices
US-9209098-B2 · Dec 8, 2015 · US
MOS devices with mask layers and methods for forming the same
US-9159802-B2 · Oct 13, 2015 · US
Page-width array printing device
US-9022525-B2 · May 5, 2015 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Metal core printed circuit board and electronic package structure
US-9386686-B2 · Jul 5, 2016 · US
HVMOS reliability evaluation using bulk resistances as indices
US-9209098-B2 · Dec 8, 2015 · US
MOS devices with mask layers and methods for forming the same
US-9159802-B2 · Oct 13, 2015 · US
Page-width array printing device
US-9022525-B2 · May 5, 2015 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10D30/603 | 2 |
| H01L29/7835 | 2 |
| H10W90/756 | 1 |
| H05K3/445 | 1 |
| Y02P70/611 | 1 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 3 |
| Physics | 1 |
| Operations & Transport | 1 |
| Cross-Sectional Technologies | 1 |