Semiconductor package and method of forming the same
US-2018374717-A1 · Dec 27, 2018 · US
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Powertech Technology Inc patents in 2018
Powertech Technology Inc was listed as an assignee on 47 patent publications in 2018.
| Metric | Value |
|---|---|
| Company | Powertech Technology Inc |
| Year | 2018 |
| Patents | 47 |
Patents
Representative publications for Powertech Technology Inc in 2018.
Chip package structure comprising encapsulant having concave surface
US-10163834-B2 · Dec 25, 2018 · US
Manufacturing method of redistribution layer
US-2018366344-A1 · Dec 20, 2018 · US
Chip package structure with conductive pillar and a manufacturing method thereof
US-10157828-B2 · Dec 18, 2018 · US
Package structure and manufacturing method thereof
US-2018350708-A1 · Dec 6, 2018 · US
Top CPC classifications
Most common classification codes for Powertech Technology Inc in 2018.
| CPC | Patents |
|---|---|
| H10W74/117 | 33 |
| H10W70/60 | 32 |
| H10W90/701 | 27 |
| H10W72/241 | 26 |
| H10W74/019 | 25 |
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