Multilayer printed wiring board and multilayer metal clad laminated board
US-2018376579-A1 · Dec 27, 2018 · US
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Tomoegawa Co Ltd patents in 2018
Tomoegawa Co Ltd was listed as an assignee on 9 patent publications in 2018.
| Metric | Value |
|---|---|
| Company | Tomoegawa Co Ltd |
| Year | 2018 |
| Patents | 9 |
Patents
Representative publications for Tomoegawa Co Ltd in 2018.
Matched-type electromagnetic wave absorber
US-2018354242-A1 · Dec 13, 2018 · US
Thermal transfer image receiving sheet
US-2018272778-A1 · Sep 27, 2018 · US
Multilayer printed wiring board, multilayer metal-clad laminated board, and resin-coated metal foil
US-2018270945-A1 · Sep 20, 2018 · US
Thermosetting adhesive composition, thermosetting adhesive film, and composite film
US-2018258324-A1 · Sep 13, 2018 · US
Top CPC classifications
Most common classification codes for Tomoegawa Co Ltd in 2018.
| CPC | Patents |
|---|---|
| B32B27/32 | 4 |
| B32B15/08 | 3 |
| B32B15/085 | 3 |
| B32B15/20 | 3 |
| B32B27/20 | 3 |
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