Method and apparatus for producing a non-uniform coating on a substrate
US-9266144-B2 · Feb 23, 2016 · US
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Maier Gary W patents
Maier Gary W holds 4 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 4 |
| Recent patents | 0 |
| First publication | Mar 24, 2015 |
| Latest publication | Feb 23, 2016 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Optimizing heat transfer in 3-D chip-stacks
US-9189037-B2 · Nov 17, 2015 · US
Physical design symmetry and integrated circuits enabling three dimentional (3D) yield optimization for wafer to wafer stacking
US-9029234-B2 · May 12, 2015 · US
Distribution manifold with multiple dispensing needles
US-8986786-B2 · Mar 24, 2015 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Method and apparatus for producing a non-uniform coating on a substrate
US-9266144-B2 · Feb 23, 2016 · US
Optimizing heat transfer in 3-D chip-stacks
US-9189037-B2 · Nov 17, 2015 · US
Physical design symmetry and integrated circuits enabling three dimentional (3D) yield optimization for wafer to wafer stacking
US-9029234-B2 · May 12, 2015 · US
Distribution manifold with multiple dispensing needles
US-8986786-B2 · Mar 24, 2015 · US
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 2 |
| Operations & Transport | 2 |
| Textiles & Paper | 1 |
| Physics | 1 |
| Cross-Sectional Technologies | 1 |
| Mechanical Engineering | 1 |
| Chemistry & Metallurgy | 1 |