Light emitting die (LED) packages and related methods
US-10256385-B2 · Apr 9, 2019 · US
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Fu Yankun patents
Fu Yankun holds 3 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 3 |
| Recent patents | 0 |
| First publication | May 5, 2015 |
| Latest publication | Apr 9, 2019 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Light emitting die (LED) packages and related methods
US-10256385-B2 · Apr 9, 2019 · US
Wafer level phosphor coating method and devices fabricated utilizing method
US-9159888-B2 · Oct 13, 2015 · US
Wafer level phosphor coating method and devices fabricated utilizing method
US-9024349-B2 · May 5, 2015 · US
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 3 |