Clamping apparatus for cleaving a bonded wafer structure and methods for cleaving
US-2015375495-A1 · Dec 31, 2015 · US
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Sunedison Semiconductor Ltd Uen201334164H patents in 2015
Sunedison Semiconductor Ltd Uen201334164H was listed as an assignee on 15 patent publications in 2015.
| Metric | Value |
|---|---|
| Company | Sunedison Semiconductor Ltd Uen201334164H |
| Year | 2015 |
| Patents | 15 |
Patents
Representative publications for Sunedison Semiconductor Ltd Uen201334164H in 2015.
Systems and methods for controlling temperatures in an epitaxial reactor
US-2015378372-A1 · Dec 31, 2015 · US
Induction heater system for a fluidized bed reactor
US-2015360141-A1 · Dec 17, 2015 · US
Methods for cleaning semiconductor substrates
US-2015357180-A1 · Dec 10, 2015 · US
Method of manufacturing high resistivity SOI substrate with reduced interface conductivity
US-9209069-B2 · Dec 8, 2015 · US
Top CPC classifications
Most common classification codes for Sunedison Semiconductor Ltd Uen201334164H in 2015.
| CPC | Patents |
|---|---|
| H10P14/24 | 5 |
| H10W10/181 | 5 |
| H01L21/76254 | 4 |
| H10P90/1916 | 4 |
| B32B43/006 | 3 |
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