Multi-chip package with offset 3D structure
US-10714462-B2 · Jul 14, 2020 · US
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Loh Gabriel H patents
Loh Gabriel H holds 10 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 10 |
| Recent patents | 0 |
| First publication | Feb 10, 2015 |
| Latest publication | Jul 14, 2020 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Distributed computing with phase change material thermal management
US-9792961-B2 · Oct 17, 2017 · US
DRAM cache with tags and data jointly stored in physical rows
US-9753858-B2 · Sep 5, 2017 · US
Stacked memory device with metadata management
US-9697147-B2 · Jul 4, 2017 · US
Stacked semiconductor chip device with phase change material
US-9331053-B2 · May 3, 2016 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Multi-chip package with offset 3D structure
US-10714462-B2 · Jul 14, 2020 · US
Distributed computing with phase change material thermal management
US-9792961-B2 · Oct 17, 2017 · US
DRAM cache with tags and data jointly stored in physical rows
US-9753858-B2 · Sep 5, 2017 · US
Stacked memory device with metadata management
US-9697147-B2 · Jul 4, 2017 · US
Stacked semiconductor chip device with phase change material
US-9331053-B2 · May 3, 2016 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10W90/724 | 5 |
| H10W90/00 | 4 |
| Y02B60/1225 | 3 |
| Y02D10/00 | 3 |
| G06F12/0864 | 2 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Physics | 8 |
| Electricity | 5 |
| Cross-Sectional Technologies | 4 |