Semiconductor device and method of forming a stackable semiconductor package with vertically-oriented discrete electrical devices as interconnect structures
US-9190297-B2 · Nov 17, 2015 · US
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Choi Daesik patents in 2015
Choi Daesik was listed as an assignee on 5 patent publications in 2015.
| Metric | Value |
|---|---|
| Company | Choi Daesik |
| Year | 2015 |
| Patents | 5 |
Patents
Representative publications for Choi Daesik in 2015.
Integrated circuit packaging system with vertical interconnection and method of manufacture thereof
US-9093392-B2 · Jul 28, 2015 · US
Integrated circuit packaging system with posts and method of manufacture thereof
US-9082887-B1 · Jul 14, 2015 · US
Integrated circuit packaging system with interconnects
US-9059108-B2 · Jun 16, 2015 · US
Integrated circuit packaging system with perimeter antiwarpage structure and method of manufacture thereof
US-8994192-B2 · Mar 31, 2015 · US
Top CPC classifications
Most common classification codes for Choi Daesik in 2015.
| CPC | Patents |
|---|---|
| H10W90/701 | 5 |
| H10W90/724 | 5 |
| H10W90/734 | 5 |
| H01L2224/16225 | 4 |
| H01L2224/32225 | 4 |
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