Package-on-package structures
US-9209163-B2 · Dec 8, 2015 · US
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Liou Shiann-Ming patents in 2015
Liou Shiann-Ming was listed as an assignee on 5 patent publications in 2015.
| Metric | Value |
|---|---|
| Company | Liou Shiann-Ming |
| Year | 2015 |
| Patents | 5 |
Patents
Representative publications for Liou Shiann-Ming in 2015.
Formation of package pins in semiconductor packaging
US-9123699-B1 · Sep 1, 2015 · US
Semiconductor package with a semiconductor die embedded within substrates
US-9070679-B2 · Jun 30, 2015 · US
Recessed semiconductor substrates and associated techniques
US-9034730-B2 · May 19, 2015 · US
Attaching passive components to a semiconductor package
US-8987830-B2 · Mar 24, 2015 · US
Top CPC classifications
Most common classification codes for Liou Shiann-Ming in 2015.
| CPC | Patents |
|---|---|
| H01L2924/15311 | 4 |
| H10W72/884 | 4 |
| H10W74/00 | 4 |
| H01L2224/16225 | 3 |
| H01L2224/32225 | 3 |
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