Package structure to enhance yield of TMI interconnections
US-9613933-B2 · Apr 4, 2017 · US
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Aravamudhan Srinivasa R patents in 2017
Aravamudhan Srinivasa R was listed as an assignee on 1 patent publication in 2017.
| Metric | Value |
|---|---|
| Company | Aravamudhan Srinivasa R |
| Year | 2017 |
| Patents | 1 |
Patents
Representative publications for Aravamudhan Srinivasa R in 2017.
Top CPC classifications
Most common classification codes for Aravamudhan Srinivasa R in 2017.
| CPC | Patents |
|---|---|
| H01L2224/13023 | 1 |
| H01L2224/16238 | 1 |
| H01L2225/06513 | 1 |
| H01L23/3128 | 1 |
| H01L23/49816 | 1 |
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